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Description
半导体材料
1.硅片
Prime Wafer衬底硅片
Test Wafer工艺验证片、调机片、工艺单步验证、炉管挡片
2.SiO2片 栅氧化层、STI 隔离、层间绝缘、钝化、硬掩膜
3.SiN(Si₃N₄)表面钝化保护层、侧墙 Spacer、硬掩膜、
4.SOI 片
5.外延片
其他衬底材料
玻璃
磷化铟 InP,
砷化铟InAs,
氮化镓GaN
砷化镓
GaAs
碳化硅 SiC
Feature Products
Visual Check: Cross-section
Visual Check: De-capsulation
Visual Check: AOI
Equipment Name :SAT (Scanning Acoustic Microscope)
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