Main Test Items： 1. Observation of device surface defects: scratches, cracks, contamination, oxidation 2. Surface morphology inspection of solder joints and pins 3. 2D dimension measurement: line width, aperture, gap, defect length 4. 3D topography & height measurement: step height, surface relief, warpage 5. Failure analysis of die surface, pads and bonding wires after decapsulation
